Molex says its zSFP+ Interconnect System now supports channels with individual lane data rates up to 56Gb/s PAM-4, providing enhanced signal integrity for next-generation Ethernet and Fibre Channel applications.
The cages and cable assemblies that make up the zSFP+ Interconnect System come in a stacked 2xN configuration to meet the needs of OEMs requiring high-density interconnects. The product range includes EMI-protected ganged cages, which are available in multiple port sizes from 2x1 through 2x12.
While supporting higher speeds and densities, the updated Molex products still maintain the low insertion loss, crosstalk, thermal management and EMI containment that users are accustomed to from the previous zSFP+ Interconnect System.
The product is the first of its kind on the market, the company claims.
“As more devices are connected to the internet and bandwidth demand continues to increase, being able to stay ahead of the curve on the backend becomes more challenging for data centres, networking OEMs and telecoms.” said Chris Hagerman, global product manager, Molex. “Molex provides a passively cooled solution by using an enhanced airflow cage design to maximize airflow through the cage and connector effectively lowering the temperatures by about 17 degrees Celsius. This yields optimal thermal management for next-generation systems while eliminating the need for costly heat sinks or cooling modules.”
Molex has also designed a new terminal and wafer on the stacked integrated connectors within the zSFP+ Interconnect System to provide enhanced signal integrity for 56Gb/s PAM-4 applications. The system allows users to combine standard cables and modules with the higher-data-rate components.